88sa8040-tbc1资料 | |
88sa8040-tbc1 |
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file size : 116 kb
manufacturer:marvell description:ground reference to lvds and cmos circuitry. for the llp package, the dap is used as the primary gnd connection to the device. the dap is the exposed metal contact at the bottom of the llp-28 package. it should be connected to the ground plane with at least 4 vias for optimal ac and thermal performance. |
1pcs | 100pcs | 1k | 10k | ||
型 号:88sa8040-tbc1 厂 家:marvell 封 装:0745 批 号:qfp64 数 量:4680 说 明:特价出售,全新原装.部份无铅 |
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