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| bcm7015kpb资料 | |
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bcm7015kpb |
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file size : 116 kb
manufacturer:broadcom description: the 300c/w for the sotc23 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 416 milliwatts. there are other alternatives to achieving higher power dissipation from the sotc23 package. another alternative would be to use a ceramic substrate or an aluminum core board such as thermal cladt. using a board material such as thermal clad, an aluminum core board, the power dissipation can be doubled using the same footprint. |
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| 1pcs | 100pcs | 1k | 10k | ||
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型 号：bcm7015kpb 厂 家：broadcom 封 装：bga 批 号：07 数 量：980 说 明：全新原装，价优.欢迎来电查询 |
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运 费： 所在地： 新旧程度： |
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| 联系人：林浩/林妮 |
| 电 话：0755-82532799/82532766/83989559 |
| 手 机：13510168121/13725556003 |
| qq：496982847/351622092 |
| msn：linearic@hotmail.com |
| 传 真：0755-82532766 |
| email：maxim_zi@126.com |
| 公司地址： 深圳市福田区佳和大厦b座1802室 门市部：华强广场 q2a114展销柜 |
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