ltc3827eg资料 | |
ltc3827eg |
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file size : 116 kb
manufacturer:linear description:(2) jc data values stated are derived from mil-std-1835b which states the baseline values shown are worst case (mean 2s) for a 60 60 mil microcircuit device silicon die and applicable for devices with die sizes up to 14,400 square mils. for device die sizes greater than 14,400 square mils use the following values, dual-in-line, 11c/w; flat pack and pin grid array, 10c/w. (3) ja (junction-to-ambient) applies to devices mounted to five square inch fr4 pc board with one ounce copper where noted. when resitance range is given, lower values are for five square inch aluminum pc board. test pwb is 0.062 inches thick and typically uses 0.635 mm trace widths for power packages and 1.3 mm trace widths for non-power packages with a 100 100 mil probe land are at the end of each trace. |
1pcs | 100pcs | 1k | 10k | ||
型 号:ltc3827eg 厂 家:linear 封 装:0529 批 号:smd 数 量:2963 说 明: |
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运 费: 所在地: 新旧程度: |
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联系人:林浩/林妮 |
电 话:0755-82532799/82532766/83989559 |
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公司地址: 深圳市福田区佳和大厦b座1802室 门市部:华强广场 q2a114展销柜 |