ltc3835edhc-1资料 | |
ltc3835edhc-1 |
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file size : 116 kb
manufacturer:linear description:note 6: junction-to-ambient thermal resistance (ja) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the jedec standard jesd51-7. the test board is a 4 layer fr-4 board measuring 102mm x 76mm x 1.6mm with a 2 x 1 array of thermal vias. the ground plane on the board is 50mm x 50mm. thickness of copper layers are 36µm/18µm /18µm/36µm (1.5oz/1oz/1oz/1.5oz). ambient temperature in simulation is 22˚c, still air. power dissipation is 1w. |
1pcs | 100pcs | 1k | 10k | ||
型 号:ltc3835edhc-1 厂 家:linear 封 装:0611 批 号:smd 数 量:2445 说 明: |
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