max8864teuk-t资料 | |
max8864teuk-t |
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file size : 116 kb
manufacturer:maxim description:a thermally enhanced large pad leadframe has been incorporated into the standard sot-23 package to produce a hexfet power mosfet with the industry's smallest footprint. this package, dubbed the micro3™, is ideal for applications where printed circuit board space is at a premium. the low profile (<1.1mm) of the micro3 allows it to fit easily into extremely thin application environments such as portable electronics and pcmcia cards. the thermal resistance and power dissipation are the best available. |
1pcs | 100pcs | 1k | 10k | ||
型 号:max8864teuk-t 厂 家:maxim 封 装:0610 批 号:ssot23 数 量:4986 说 明: |
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运 费: 所在地: 新旧程度: |
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联系人:林浩/林妮 |
电 话:0755-82532799/82532766/83989559 |
手 机:13510168121/13725556003 |
qq:496982847/351622092 |
msn:linearic@hotmail.com |
传 真:0755-82532766 |
email:maxim_zi@126.com |
公司地址: 深圳市福田区佳和大厦b座1802室 门市部:华强广场 q2a114展销柜 |