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| mc33178dr2资料 | |
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mc33178dr2 |
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file size : 116 kb
manufacturer: description:micro networks has subjected their vcso component to various reflow profiles and test conditions for optimum substrate mounting performance. the conditions suggested here are recommended temperature settings for the vcso device during the reflow processes. the best case condition for the device is a slow ramp up to prevent thermal shock before reaching reflow temperatures of sn/pb flux activated solder with a melting point of 183 degree celsius. the mc33178dr2 device should not see temperatures above 183 degrees celsius for an extended periods beyond 60 seconds. maximum peak temperature for the device should not exceed 220 degrees celsius for longer then 20 seconds. |
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| 1pcs | 100pcs | 1k | 10k | ||
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型 号：mc33178dr2 厂 家： 封 装：0611 批 号： 数 量：2189 说 明： |
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运 费： 所在地： 新旧程度： |
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| 联系人：林浩/林妮 |
| 电 话：0755-82532799/82532766/83989559 |
| 手 机：13510168121/13725556003 |
| qq：496982847/351622092 |
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| email：maxim_zi@126.com |
| 公司地址： 深圳市福田区佳和大厦b座1802室 门市部：华强广场 q2a114展销柜 |
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