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mcm67b618fn18,价格,pdf下载,mcm67b618fn18在线订购请找深圳市浩兴电子有限公司-凯发app

mcm67b618fn18资料
mcm67b618fn18
 
file size : 116 kb
manufacturer:
description:  the melting temperature of solder is higher than the rated temperature of the device. when the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. there- fore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. • always preheat the device. • the delta temperature between the preheat and   soldering should be 100c or less.* • when preheating and soldering, the temperature of the   leads and the case must not exceed the maximum   temperature ratings as shown on the data sheet. when   using infrared heating with the reflow soldering   method, the difference shall be a maximum of 10c. • the soldering temperature and time shall not exceed   260c for more than 10 seconds. • when shifting from preheating to soldering, the   maximum temperature gradient shall be 5c or less. • after soldering has been completed, the device should   be allowed to cool naturally for at least three minutes.   gradual cooling should be used as the use of forced   cooling will increase the temperature gradient and   result in latent failure due to mechanical stress. • mechanical stress or shock should not be applied   during cooling. * soldering a device without preheating can cause exces- sive thermal shock and stress which can result in damage to the device.
 
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价 格  
 
 
型 号:mcm67b618fn18
厂 家:
封 装:0510
批 号:
数 量:4356
说 明:
 
 
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新旧程度:
 
 
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公司地址: 深圳市福田区佳和大厦b座1802室 门市部:华强广场 q2a114展销柜
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