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| opa703ua资料 | |
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opa703ua |
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file size : 116 kb
manufacturer: description:ja values shown are typical for standard test pcbs only. for high-power dissipation applications, use of the powerpad package with the powerpad on the underside of the chip. this acts as a heatsink and must be connected to a thermally dissipating plane for proper dissipation. failure to do so may result in exceeding the maximum junction temperature which could permanently damage and/or reduce the lifetime the device. see ti technical brief slma002 for more information about utilizing the powerpad thermally enhanced package. use of packages without the powerpad or not soldering the powerpad to the pcb, should be limited to low-power dissipation applications. |
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| 1pcs | 100pcs | 1k | 10k | ||
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型 号：opa703ua 厂 家： 封 装：0618 批 号：smd 数 量：7758 说 明： |
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运 费： 所在地： 新旧程度： |
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| 联系人：林浩/林妮 |
| 电 话：0755-82532799/82532766/83989559 |
| 手 机：13510168121/13725556003 |
| qq：496982847/351622092 |
| msn：linearic@hotmail.com |
| 传 真：0755-82532766 |
| email：maxim_zi@126.com |
| 公司地址： 深圳市福田区佳和大厦b座1802室 门市部：华强广场 q2a114展销柜 |
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