osia-naa资料 | |
osia-naa |
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file size : 116 kb
manufacturer: description: the power dissipation of the scc59 is a function of the pad size. this can vary from the minimum pad size for sol- dering to the pad size given for maximum power dissipa- tion. power dissipation for a surface mount device is deter- mined by tj(max), the maximum rated junction temperature of the die, rqja, the thermal resistance from the device junction to ambient; and the operating temperature, ta. us- ing the values provided on the data sheet, pd can be calcu- lated as follows. |
1pcs | 100pcs | 1k | 10k | ||
型 号:osia-naa 厂 家: 封 装:0611 批 号:smd 数 量:2450 说 明: |
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运 费: 所在地: 新旧程度: |
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