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| ucc5630amwp资料 | |
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ucc5630amwp |
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file size : 116 kb
manufacturer: description:2. the ground pad of the cx65105 pa has special electrical and thermal grounding requirements. this pad is the main thermal conduit for heat dissipation. since the circuit board acts as the heat sink, it must shunt as much heat as possible from the amplifier. as such, design the connection to the ground pad to dissipate the maximum wattage produced to the circuit board. multiple vias to the grounding layer are required. |
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| 1pcs | 100pcs | 1k | 10k | ||
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型 号：ucc5630amwp 厂 家： 封 装：0607 批 号：dip/sop 数 量：970 说 明： |
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运 费： 所在地： 新旧程度： |
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| 联系人：林浩/林妮 |
| 电 话：0755-82532799/82532766/83989559 |
| 手 机：13510168121/13725556003 |
| qq：496982847/351622092 |
| msn：linearic@hotmail.com |
| 传 真：0755-82532766 |
| email：maxim_zi@126.com |
| 公司地址： 深圳市福田区佳和大厦b座1802室 门市部：华强广场 q2a114展销柜 |
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